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THERM-A-GAP PAD 80 Thermally Conductive Gap Filler Pads
*PRODUCT IMAGE IS REPRESENTATIVE PROVIDED BY THE MANUFACTURER. DO NOT MAKE BUYING DECISIONS SOLEY BASED ON THE IMAGE. PLEASE VERIFY SPECIFICATIONS MEET YOUR REQUIREMENTS.
Parker Chomerics THERM-A-GAP™ PAD 80 is a high performance, thermally conductive gap filler pad with a thermal conductivity of 8.3 W/m-K. It provides excellent heat transfer across a range of thicknesses while maintaining low compression forces and conformability between mating surfaces.
THERM-A-GAP™ PAD 80 is designed to serve as an effective thermal interface between heat sinks and heat generating components on electronic devices where uneven surfaces, air gaps, and rough surfaces may exist. This material exhibits low silicone oil bleeding and is ideal for high thermal performance needs across industries.
PAD 80 is available in standard thicknesses from 0.030” to 0.200” (0.75mm to 5.1mm) and can be provided in sheets or cut to custom part sizes. It is available on several material carriers including an aluminum foil carrier that is supplied with pressure sensitive adhesive (PSA) for added adhesive strength during the assembly process
Product Features:
• 8.3 W/m-K thermal conductivity
• Low compression force for deflection
• Low silicone oil bleeding
• UL 94 V-0 flammability rating
• Available with a pressure sensitive adhesive (PSA)
• Passes NASA outgassing requirements
Typical Applications:
• 5G and Telecom equipment
• Smart home devices
• Automotive electronics
• LEDs
• Power supplies
• Computing modules and servers
• Memory and data storage units
Read More...THERM-A-GAP™ PAD 80 is designed to serve as an effective thermal interface between heat sinks and heat generating components on electronic devices where uneven surfaces, air gaps, and rough surfaces may exist. This material exhibits low silicone oil bleeding and is ideal for high thermal performance needs across industries.
PAD 80 is available in standard thicknesses from 0.030” to 0.200” (0.75mm to 5.1mm) and can be provided in sheets or cut to custom part sizes. It is available on several material carriers including an aluminum foil carrier that is supplied with pressure sensitive adhesive (PSA) for added adhesive strength during the assembly process
Product Features:
• 8.3 W/m-K thermal conductivity
• Low compression force for deflection
• Low silicone oil bleeding
• UL 94 V-0 flammability rating
• Available with a pressure sensitive adhesive (PSA)
• Passes NASA outgassing requirements
Typical Applications:
• 5G and Telecom equipment
• Smart home devices
• Automotive electronics
• LEDs
• Power supplies
• Computing modules and servers
• Memory and data storage units
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| Action | SKU | Availability | Price | Color | Specific Gravity | Flammability Rating | Shelf Life | Coefficient of Thermal Expansion | Specifications Met | Dielectric Strength | Storage Temperature | Outgassing Total Mass Loss | Dissipation Factor | Heat Capacity | Product Type | Volume Resistivity | Deflection at Pressure | Dielectric Constant | Durometer | Operating Temperature | Thermal Conductivity | Division | Thermal Impedance | Shape | Carrier Type | Size | Material Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 61-15-1015-PAD80G | Backordered | POR | Grey | 3.4 | UL 94 V-0 | 36 Months | 150 ppm/K | RoHS | 125 VAC/mil | 50 to 90 °F @ 50% RH | 0.11 % TML (0.01% CVCM) | 0.002 @ 1 MHZ | 1.00 J/g-K | Thermal Gap Pad | 10^14 ohm-cm | 64 % @ 50 psi (345 kPa) | 6 @ 1 MHZ | Softest | -67 to 392 °F | 8.3 W/m-K | Chomerics Division | 0.15 °C-cm2/W | Flat sheets | G - Woven glass without PSA | 10 in x 15 in (254 mm x 381 mm) | 0.15 in (3.81 mm) |
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